2
阅23转0刚刚2
阅19转0刚刚2
阅20转0刚刚2
阅19转0刚刚2_2_20 - solder paste metal content by weight
阅25转0刚刚2_2_19_1 - length and width of laminate and preprep
阅19转0刚刚2_2_19 - measuring hole pattern location
阅10转0刚刚2_2_18_1 - thickness of laminate by cross-section
阅27转0刚刚2_2_18 - thickness of laminate by mechanical measurement
阅20转0刚刚2_2_17 - surface roughness and profile of metallic foil
阅20转0刚刚2_2_16_1 - artwork master evaluation by overlay
阅17转0刚刚2_2_16 - artwork master evaluation by use of driller panel
阅8转0刚刚2_2_16 - artwork master evaluation by use of driller panel
阅8转0刚刚2_2_15 cable dimension (flat)
阅15转0刚刚2_2_14_1 - solder powder size - measuring microscope
阅20转0刚刚2_2_14 - solder powder size - screen method
阅17转0刚刚2_2_13_1 - thickness and plating in hole microhm method
阅15转0刚刚2_2_12_3 - weight of copper by etchable carrier
阅12转0刚刚2_2_12_1 overall thickness of copper foil
阅16转0刚刚2_2_12 - thickness of copper by weight
阅18转0刚刚
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设计心理学2：与复杂共处
